CIT's CuFlat-PKGCore is a board for next-generation AI accelerators, with a glass substrate with ultra-flat, ultra-thin copper deposited on it. With the growth of AI services, the demand for high-speed, large-capacity data processing increases, and glass substrate technology is gaining attention as a replacement for conventional FR4(standard fiberglass circuit board) substrates. To address these issues, CIT has eliminated chemical waste generation by using its proprietary dry ultra-flat copper deposition process instead of chemical plating. Our product has successfully developed an HVLP 6-grade product, which is 200 times flatter than the HVLP 4-grade currently used in NVIDIA's AI accelerators. Additionally, CuFlat-PKGCore has high thermal stability, enabling it to operate stably at temperatures 20°C higher than the operating temperature of existing data centers (IDCs), thereby contributing to energy savings in IDCs. CIT aims to lead the next generation of AI technology with CuFlat-PKGCore, a sustainable eco-friendly technology.