AirJet®  Mini G2 by Frore Systems, the next generation of AirJet the world’s first solid-state active cooling chip, and is revolutionizing the electronics industry yet again with 50% higher heat removal than the original AirJet Mini. Each AirJet Mini G2 removes 7.5W of heat, unleashing full potential in devices, from Laptops and Smartphones, to Mini PCs and SSD accessories. Embedding one or multiple chips in consumer products enables heat removal solving the thermal issues causing device performance to throttle. The award-winning design has demonstrated record-breaking over 3x in performance improvements across a wide range of consumer and industrial embedded applications. With each chip removing 7.5W of heat, two chips can remove 15W, three chips 22.5W and so on, AirJet Mini G2’s compact size and scalability means manufacturers can adopt this revolutionary heat removal technology in a wide range of applications enabling faster, thinner, lighter, silent, and dust-proof devices.